在使用的過程中會有缺陷:不合格的分發點的大小,大小的針,針之間的距離和PCB,膠溫度、膠水粘度、拉絲、膠浸焊墊、固化強度不好,容易降低碎片。為了解決這些問題，需要對技術參數進行整體研究，從而找到問題的解決方案。
　　There will be defects in the process of use: the size of unqualified distribution points, the size of pins, the distance between pins and PCB, bad glue temperature, glue viscosity, wire drawing, glue immersion pad, curing strength, easy to reduce debris. In order to solve these problems, we need to study the technical parameters as a whole to find the solution.
　　1. 上膠量
　　1. sizing
　　根據工作經驗，焊點的直徑應該是焊盤之間距離的一半，貼片后的膠點直徑應該是膠點直徑的1.5倍。這將確保有足夠的膠水來粘合組件，并避免太多的膠水染墊。由螺桿泵的旋轉時間來決定，在實際操作中應根據生產情況(室溫、膠水粘度等)來選擇泵的旋轉時間。
　　According to the work experience, the diameter of the solder joint should be half of the distance between the pads, and the diameter of the glue point after the patch should be 1.5 times of the diameter of the glue point. This will ensure that there is enough glue to bond the components and avoid too much glue to dye the pad. It is determined by the rotation time of the screw pump. In actual operation, the rotation time of the pump should be selected according to the production conditions (room temperature, glue viscosity, etc.).
　　2. 配藥壓力(背壓)
　　2. Dispensing pressure (back pressure)
　　目前的點膠機使用螺桿泵給點膠針軟管加壓，保證螺桿泵有足夠的供膠量。背壓過大，容易造成橡膠溢出，橡膠量過大;壓力過小會出現點膠間歇現象，漏氣，造成缺陷。應根據膠水的質量相同，工作環境的溫度來選擇壓力。較高的環境溫度會使膠水的粘度變小，流動性更好，這時需要減少背壓以保證膠水的供應，反之亦然。
　　At present, screw pump is used in dispensing machine to pressurize dispensing needle hose to ensure that screw pump has enough glue supply. If the back pressure is too large, it is easy to cause rubber overflow and too much rubber; if the pressure is too small, it will cause intermittent phenomenon of dispensing, air leakage and defects. The pressure should be selected according to the same quality of glue and the temperature of working environment. Higher ambient temperature will make the viscosity of glue smaller and the fluidity better. At this time, it is necessary to reduce the back pressure to ensure the supply of glue, and vice versa.
　　3.針的大小
　　3. Needle size
　　在實踐中,針直徑大小應該分配膠點直徑的1/2,調劑過程中,應該選擇根據PCB板分發針頭大小,如0805年和1206年的焊盤大小相似,您可以選擇同樣的針,但對于不同的焊盤會選擇不同的針,以確保凝膠點的質量,可以提高生產效率。
　　In practice, the diameter of the needle should be assigned to 1/2 of the glue point diameter. During the dispensing process, the size of the needle should be distributed according to the PCB plate. If the size of the pads in 0805 and 1206 is similar, you can choose the same needle, but different pins will be selected for different pads to ensure the quality of the gel point and improve the production efficiency.
　　4. 針和PCB之間的距離
　　4. Distance between pin and PCB
　　不同的分配器使用不同的針，有些針有一定的停止度(如CAM/A LOT 5000)。每項工作開始時，都要校準針與PCB的距離，即校準z軸高度。
　　Different dispensers use different needles, some of which have a certain stopping degree (such as cam / a lot 5000). At the beginning of each work, calibrate the distance between the needle and PCB, that is, calibrate the z-axis height.

　　5. 水的溫度
　　5. Water temperature
　　一般環氧樹脂膠應存放在0- 5℃冰箱中，使用時應提前1/2小時取出，使膠液與工作溫度完全一致。膠水使用溫度為23℃—25℃;環境溫度對膠的粘度有很大的影響。5℃的環境溫度差異將導致配藥量變化50%。因此，應控制環境溫度。同時，環境的溫度也應給定，以保證濕度小的粘著點容易干燥，影響粘著力。
　　Generally, the epoxy resin glue should be stored in the refrigerator at 0-5 ℃, and taken out 1 / 2 hour in advance when using, so that the glue solution is completely consistent with the working temperature. The temperature of glue is 23 ℃ - 25 ℃; the ambient temperature has a great influence on the viscosity of glue. The difference of ambient temperature at 5 ℃ will result in 50% change of dosage. Therefore, the ambient temperature should be controlled. At the same time, the temperature of the environment should also be given to ensure that the adhesion point with low humidity is easy to dry and affect the adhesion.
　　6. 膠的粘度
　　6. Viscosity of glue
　　膠液的粘度直接影響著膠液的質量。粘度較大時，則膠點會變小，甚至出現拉絲現象;粘度小，膠點會變大，然后可能會滲透到焊盤上。在上膠過程中，應根據膠水的粘度不同，選擇合理的背壓和上膠速度。
　　The viscosity of glue directly affects the quality of glue. When the viscosity is large, the glue point will become smaller, or even wire drawing will occur; when the viscosity is small, the glue point will become larger, and then it may penetrate into the pad. In the process of gluing, the reasonable back pressure and gluing speed should be selected according to the viscosity of glue.
　　7. 固化溫度曲線
　　7. Curing temperature curve
　　對于膠水固化，一般廠家都給出了溫度曲線。在實踐中應盡量采用高溫固化，使固化后的膠水有足夠的強度。
　　For glue curing, temperature curves are given by general manufacturers. In practice, high temperature curing should be used as far as possible to make the cured glue have enough strength.
　　以上就是雙組份打膠機對全自動封膠機使用注意事項的詳細介紹，想要了解更多請點擊官網http://www.yalais.com
　　The above is a detailed introduction of the two-component gluing machine to the precautions for the full-automatic gluing machine. To learn more, please click the official website http://www.yalais.com